Metal Core PCB Fabrication

with Concurrent Engineering and Assembly / Integration Services
 

High Power LED, Power and Motion Control Applications generate heat that often can not be cooled through the traditional use of fans. Conduction cooling through a baseplate is often the only cooling method available, unfortunately, this requires a shift in the way engineers typically design for heat dissipation. Instead of thermal energy leaving the source through the air, cooling is achieved through conductive measures. Cofan's MCPCB Concurrent Engineering Services helps engineers utilize the right thermal interface materials and components selection to withstand satisfy their application's isolation and temperature requirements.  Our high level engineering support reduces the need for multiple prototypes, saving substantial and time and money.

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