Aluminum Board Fabrication & Concurrent Engineering

Cofan PCB Manufacturer

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Inquires on MCPCB
1(800)766-6097

mcpcbinfo@cofan-usa.com


Cofan USA @
Silicon Valley
46177 Warm Springs Blvd.
Fremont, CA 94539
Phone: 1(510)490-7533
Fax: 510-490-7931
E-mail: info@cofan-usa.com

 

Cofan Canada
Phone: 1(905)761-8887
Email to Cofan Canada Office

Cofan Taiwan
Phone: 011 886-2-8686-2060
Email to Cofan Taiwan Office

Overview

  • Single Layer, Multiple Layer MCPCB or FR4
  • Surface mounted components / wave soldering
  • Solder mask coloring
  • Machined features
  • Low / High Volume
  • Turn key operation
  • Quick lead time / turn around
  • Testing
  • Cables / Connectors

Services We Offer
  • Excellent Customer Service
  • Low Cost
  • Rapid prototyping
  • Complete Thermal Analysis / Design
  • Custom Heat Sinks
  • Mechanical Design
  • Circuit / Electrical Design

Thermal Analysis
  • We will help you solve your thermal issues!

    Importance of CFD: Prediction of thermal performance of LEDs results in reducing the time to bring products to market. We can easily run a simulation to predict the thermal characteristics of a specific PCB or system. We then iterate to come up with the thermal solution that suits your criteria. This reduces the need for several prototypes, resulting in a quicker turn around. CFD is becoming widely used in thermal analysis on all electronic products during the design phase.
A simple MCPCB has 3 layers, the copper circuit layer, the thermally conductive dielectric layer, and the metal core base layer. These three layers are then laminated together. The lamination technique bonds the three layers together, providing a path for the heat to dissipate.



Metal Core Layer
This layer can be made out of aluminum, copper, or steel. Aluminum is commonly selected due to its cost, weight and thermal characteristics. Typical thickness for aluminum is 1.0mm to 3.2mm, and typical aluminum alloys used are: AL6061, AL5052, AL1370, AL770, and AL710. In some cases where the heat dissipation takes priority over cost, copper is used for the base layer. Typically a heat-sink is attached to the metal base to further dissipate heat away from the components.

Dielectric Layer
The dielectric layer is the most important layer in the MCPCB because it must maintain electronic insulation while also being thermally conductive. The dielectrics thickness plays an important role because it must be thick enough so the copper circuit does not short out, yet thin enough to maintain high thermal performance. Typical thickness of this layer is between .075mm to .2mm (.003” - .008”). Thicker or thinner layers can be used depending on voltage and current.

Copper Circuit Layer
This layer is a traditional PCB circuit. The thickness can be anywhere between 35µm to 350µm (1 - 10 oz/ft2). A green or black solder mask coating covers the entire board to protect the circuit. Unlike PCBs, a thicker copper layer can be used if the circuit requires higher current flow.