COFAN offers customizable heatsinks that are manufactured with a 2000T press.
COFAN offers high-performance fans designed for telecom, networking, data centers, and cloud storage applications.
COFAN offers COBs (chip-on-board) with customizable substrates.
MCPCBs have integrated heatsinks and are able to dissipate heat more effectively than conventional PCBs.
FR-4 PCB is the standard PCB used in all industries for its cost-effectiveness.
Rigid & Flex PCBs are able to bend and flex.
The Super Pillar is COFAN's unique and patented technology designed to dissipate extreme heat.
The UVC Ceramic MCPCB is designed for UVC lighting applications and is resistant to extreme heat and UV radiation.
The Ultra-RF Ceramic PCB is designed for high radio-frequency applications like Bluetooth and routers.
