ULTRA-RF Ceramic mcpcb™
ULTRA-RF Ceramic MCPCB™️ Technology
The materials used in standard FR-4 PCBs and conventional MCPCBs often inhibit radio signals by introducing noise and electromagnetic interference, so COFAN developed the new Ultra-RF Ceramic MCPCB™ that allows for full signal pass-through. As the name suggests, we use low di-electric impedance materials that enable a stronger, higher frequency signal commonly used in routers and Bluetooth devices. Other uses include solid-state amplifiers, low- and high-pass filter amplifiers, signal converters, and more.
The Ultra-RF Ceramic MCPCB™ uses plated, grounding vias with customizable layers of copper to create a reference layer, minimizing di-electric loss, offering better impedance control, and ensuring signal integrity. On the back, we use a nickel or tin plated aluminum for direct metal to metal bonding, increasing heat dissipation. The Ultra-RF MCPCB™ is COFAN’s simple yet effective solution designed to meet all your radio-frequency needs.
Introducing COFAN's Ultra-RF MCPCB™
01
Concept
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Build a MCPCB for full signal pass-through
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Provide a turn-key solution for high frequency signals used in routers, Bluetooth devices, and more
02
Innovative materials
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Low di-electric impedance materials like ceramic material for a lower di-electric constant (DK)
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Integrated reference layer, grounded by vias, offers better impedance control and ensures signal integrity
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Customizable layers and thickness for a stronger signal
03
Advantages
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Better signal strength and output
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Improved impedance control
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Increased heat dissipation
APPLICATIONS
The Ultra-RF MCPCB™ is COFAN’s simple yet effective solution designed to meet all your radio-frequency needs.
APPLICATIONS
Routers
Microwave Satellite Communication
Bluetooth devices
Low-pass/high-pass filter amplifiers