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Super PIllar
Case Study
Super Pillar™ Technology Case Study
When COFAN's customers want the best in thermal management for PCBs, we recommend our patented Super Pillar™️ technology.
We don't expect you to trust us on faith alone so we've partnered up with a customer of ours to do thermal tests (with a FLIR camera), pitting our Super Pillar™️ against our competitor's aluminum and copper MCPCBs with real, hard numbers.
Thermal Performance Test
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3 array constructions tested
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Super Pillar, copper substrate (COFAN)
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MCPCB, aluminum substrate (competitor)
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MCPCB, copper substrate (competitor)
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Target Tjmax=85°C
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LED regulation to be enabled at Tjmax=90°C, intensity throttled
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Competitor's MCPCB
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COFAN Super Pillar technology
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X-ray of the Super Pillar
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Cofan's 2 Layer Copper Super Pillar
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Spot 1 temperature: 94.5℃ (Tjmax)
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Spot 2 temperature: 77.0℃
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Sekisui KNDJ002 3mil
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Breck Heatsink
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2500B5601-COFAN-1A SN 03
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1050mA / 1225mA (Lime)
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t=30s
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Sunon PMD2412PMB1-A(2).GN at 12V
COFAN's Super Pillar thermal temperatures
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Competitor's aluminum thermal temperatures
Competitor's 2 Layer Aluminum
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Spot 1 temperature: 96.5℃
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Spot 2 tempearture: 113.9℃ (Tjmax)
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Breck heatsink
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2500B5601-1A SN 05
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1050mA / 1225mA (Lime)
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t=30s
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Sunon PMD2412PMB1-A(2).GN at 12V
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Competitor's copper thermal temperatures
Competitor's 2 Layer Copper
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Spot 1 temperature: 88.9℃
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Spot 2 temperature: 99.0℃ (Tjmax)
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Breck Heatsink
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2500B5601-1A SN 05
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1050mA / 1225mA (Lime)
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t=30s
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Sunon PMD2412PMB1-A(2).GN at 12V
Conclusion
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Performance is highly dependent on the dielectric thickness.
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There was a 33% improvement in cross-sectional areas when changing from 0.004” to 0.003” dielectric material.
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High-performance dielectrics alone did not provide adequate dissipation from the LED package. A large, direct conduit (like COFAN's Super Pillar technology) are needed to draw sufficient heat away from the LEDs.
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Our customer, convinced by the test, proceeded to order our 2-layer Super Pillar™️ product for its low LED temperatures.